New compact products available: 

   Size = 75 cm wide X 108 cm deep!

------------- Corial 200FA --------------
Fast die deprocessing using
HCD (Hollow Cathode Discharge)

-------------- Corial 200I ---------------
ICP etcher for die / wafer deprocessing

------------- Corial 200ML --------------
ECR etcher for low damage etching 

-------------- Corial 300IL --------------
350 mm ICP etcher with load-lock
Special design for sapphire etching!

-------------- Corial 400L ---------------
Large area RIE etcher with load-lock
for OLED made on 14" X 14" substrates

------------- Corial D350L --------------
Large area PECVD tool (300 mm) with
vacuum load-lock operating at 325°C

------------- Corial 200D ---------------
Low temperature ICP PECVD tool with
vacuum load-lock operating < 150°C

         New processes available:

- ICP of Sapphire with high throughput,

- Fast ICP of GaAs via-holes,

- Fast ICP of SiC via-holes,

- Low damage GaN etching,

- High resolution Si etching (20 nm),

- Deep Silicon Etching (50 µm), 

- SiC and aSi-H deposition,

- Low temperature deposition (<150°C) 

- Liquid sources available, 

- Superlattice deposition.

           Product Key Features:

- Highly Versatile (many applications
  in the same process chamber),

- Stress control of high quality films,

- Low Cost of Ownership,

- Internet real time process support.