Size = 75 cm wide X 108 cm deep!

   
------------ Corial 200FA ---------------
Fast die deprocessing using
HCD (Hollow Cathode Discharge)

---------- Corial 200R ---------------
Cost effective RIE tool for 8" wafers

---------- Corial 200RL --------------
Cost effective RIE tool with
vacuum load-lock for 8" wafers

------------ Corial 200I ---------------
ICP etcher for die / wafer deprocessing

---------- Corial 200IL --------------
ICP etcher with vacuum load-lock
Special design for sapphire etching! 

---------- Corial D250L -------------
High performance PECVD tool with
vacuum load-lock operating at 325°C
 

         New processes available:

- ICP of Sapphire with high throughput,

- Fast ICP of GaAs via-holes,

- Fast ICP of SiC via-holes,

- Low damage GaN etching,

- High resolution Si etching (20 nm),

- SiC and aSi-H deposition,

- Liquid sources available, 

- Superlattice deposition. 

           Product Key Features:

- Highly Versatile (many applications
in the same process chamber),

- Stress control of high quality films,

- Low Cost of Ownership,

- Real-time process support through internet.