Corial 200FA
RIE system controlled by PC with software operating under Linux dedicated to die delayering. It uses fluorinated reactive gases for Si, SiO2, Si3N4 and polyimide etching. The reactor is equipped with a device creating a small volume high density plasma by the so-called Hollow Cathode Discharge principle (HDC). When equipped with a CCD camera laser endpoint detector, it offers automatic multistep process capability.
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The Corial 200FA includes
* RIE reactor designed for 200 mm wafers and die delayering,
* 220 mm diameter cathode equipped with a Hollow Cathode Discharge device creating a small volume high density plasma suited for the die size,
* Pumping system with Alcatel (Alcatel) 2063C2 oil pump (60 m3/h, Flow Rate = 40 sccm at 100 mT),
* CPU process controller (Processor ARM 926 180 MHz, embedded software in 128 Mo Compact Flash , fast Ethernet link 100 MHz, 64 Mo of SDRAM, CAN bus, RS232),
* A set of digital and analogic Input/output module with a ARM7 processor connected to the CPU process controller via CAN bus for driving the physical devices,
* Gas box with 3 MFCs (O2, SF6, CHF3) - Max: 9 gas lines,
* 300 W RF generator at 13.56 MHz and automatic match box,
* Graphic User Interface through IBM PC operating under Linux and Firefox. It is equipped with Intel Quad-Core processor running at 2 GHz, 1 Gb of RAM and 2 X 143 Gb hard disk storage (RAID-1 mode),
* 19" LCD colour monitor with keyboard and mouse.
* Remote control through high speed internet with static IP address.
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